CEP
CEP
Electroplating Cation Membrane
CEP (Product Model) is specially developed for electroplating environments. It selectively allows Cu, Sn, and other ions to pass while blocking other additives, ensuring optimal electroplating results. Additionally, it is commonly used for purifying electroplating solutions. For environments containing hydrogen peroxide and similar substances, the perfluorosulfonic acid membrane NS-260 (Product Model) is recommended for superior performance.
Characteristics：
• Ensures exceptional stability across a wide range of acidic and alkaline environments, delivering reliable performance in demanding conditions.
• With an ultra-low ion leakage rate, ensuring the purity of the electroplating solution for high-quality results.
• High ion selectivity, effectively isolating impurities at the anode for superior process purity.
Application field：
• Electroplating in the Integrated Circuit (IC) manufacturing industry, ensuring precise and reliable results for advanced applications.
• Other non-oxidizing electroplating environments, ensuring reliable performance.
